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Key Services & Capabilities • Quick turn prototypes, 24 hours, up to 16 layers • Short run production quantities, 3 to 10 working days • Complex Stackup Assistance • Mass production, 3 to 5 week • Single side, double side and multi-layer up to 38 layers • Load boards and burn-in boards • Fine pitch, SMT, BGA, Micro-BGA • Fine-line (min.0.003”) width and spacing • Controlled impedance • Blind and buried vias • Arrays-Tab Route and Scored • Castellated Holes • Panel size up to 20.2" x 23.2" • RoHS Compliant Manufacturing • Board Thickness 0.005” to 0.250”
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